NEWS, PRESS & PUBLICATIONS

01. Dec 2021
Fraunhofer Venture reports about our company

With our 10 mm² small and 100% silicon based MEMS microspeakers we aim to shape the future of the mobile internet. By increasing battery life and reducing battery drain, our silicon chips will help expand the functionality of wireless headphones to include instant translation, health monitoring and Internet of Voice services. In-ear headphones turn into better wearables.
From the Fraunhofer Venture press report in “Forschung Kompakt” you can learn all about our innovative and power-efficient sound transducer principle.

Fraunhofer Venture reports in "Forschung Kompakt" about our MEMS microspeakers for the future of the mobile internet / MEMS Sound Chip in front of TWSEarbud
30. Nov – 03. Dec 2021
Hello Tomorrow Deep Tech Days 2021

We are happy to be selected as Deep Tech Pioneer. We are attending the Hello Tomorrow Deep Tech Days 2021 from November 30 till December 3 in Paris. This event series is Europe’s biggest deep tech event. The Global Summit and the Investor Day offers us a great opportunity to network and share ideas with investors.

News: We are selected as one of the Deep Tech Pioneers!
01. Nov 2021
Heiko Weckbrodt from Oiger reports about us

Heiko Weckbrodt, journalist at Oiger, a news portal focusing on business and research in Saxony, met our CFO Jan Blochwitz-Nimoth at the investor-founder meeting “Hightech Venture Days”.
The article reports about our company and about our microelectromechanical micro speakers for smart hearables. It also provides insights into our strategic development and Series A financing goals.
Read the article in German.

MEMS Sound Chip in front of TWSEarbud
26. Oct 2021
Our article is published in DeviceMed

In our article “Smarter Alltagshelfer statt Hörgerät – Vision oder Fiktion?” by DeviceMed, you can read about the challenges facing the hearing aid industry and how we would like to contribute with our technology to the technical progress of in-ear devices.
A hearing aid worn permanently in the ear should not be too large, must offer a long battery life and have good sound quality. Users also expect more and more smart functions and artificial intelligence.
With our pure silicon MEMS microspeaker, we offer a small, lightweight, energy-efficient, scalable and cost-effective component.
The article is available in German here.

MEMS Sound Generating Lamellas inside a Chip with Labeling in German
20. Oct – 03. Dec 2021
AES Online Fall 2021

Recently introduced MEMS micro speakers target in-ear audio applications such as true wireless earbuds, hearables and hearing aids. A key requirement in these ultra-mobile applications is a high energy efficiency of the components. In our presentation at AES Fall Online 2021, you will learn why MEMS microspeakers claim this competitive advantage.
The most advanced approaches to MEMS speakers are based on capacitive transducer technology. In this contribution, we discuss some fundamental energetic relations that such electroacoustic transducers are subject to, and draw some implications for the requirements of a transducer that can operate at high efficiency.

AES Fall Online 2021 Streamcast October 2021
07. – 08. Sep 2021
MEMS World Summit EU

The MEMS World Summit EU in Munich brings together political, business, financial, research and industry leaders in the field of micro electrical mechanical systems. This world’s leading MEMS manufacturing gathering took place from 7th to 8th September. Our Head of MEMS Development, Holger Conrad explained why MEMS microspeakers made from 100% silicon are the best solution for audio reproduction in wireless in-ear headphones. In his presentation on 8th September at 4:25 p.m. CET, he showed balanced speaker designs and technology with improved linearity. 

News: MEMS World Summit Europe 2021 in Munich: our Head of MEMS Production, Holger Conrad is presenting about highly efficient balanced all-silicon electrostatic MEMS micro speakers
15. – 18. Aug 2021
DAGA 2021

The demand for wireless earbuds is increasingly shifting towards aspects beyond sound quality, such as comfort, increased battery life and integration with other electronic components. These factors impose tighter requirements in the power budget for the audio transducer.
At DAGA2021 our Head of Technical Marketing, Lutz Ehrig, answered the question of how MEMS speakers can become more powerful than moving-coil speakers and gain competitive advantage. During the online session “MEMS loudspeakers – where do we stand today?” we discussed some basic energetic relationships that such electroacoustic transducers are subject to and draw some conclusions from these relationships on the requirements for a transducer that can operate with high efficiency.

News: DAGA2021
15. July 2021
Fraunhofer reports about us

Our technology does everything differently from previous techniques. With this approach, we want to offer a new gateway into the digital world.
Our innovation: “We have virtually thrown overboard the central element of a loudspeaker, the membrane. Insted, we integrate many thin bending bars, similar to the strings of a harp, into a MEMS silicon chip. This gives us a large acoustic inner surface, but at the same time we can keep the outer surface minimal.”
Beside the innovation of our technology,  you can read in the latest article of Fraunhofer magazine how our microspeakers emerged from a failed start and what are still planing. Click here to read the article in German.

News: Fraunhofer article about Arioso Systems
12. July 2021
We are featured in Handelsblatt

Europe is increasingly disappearing from the semiconductor world map.
In 2020, only 8.5% of the industry’s turnover was generated in Europe. Between 2015 and 2020, the industry grew globally by an average of 5.6% each year, in Europe by only 1.8%.
Our CEO, Jan Blochwitz Nimoth and two other Dresden-based start-ups are quoted from a conversation with Handelsblatt, explaining their chip innovations and the potential for Europe to stop this decline in global market share. Our goal is to become a globally leading chip design house, thus also contributing to the relevance of Europe.
You can access the article here.

Small MEMS Micro Speaker
08. – 10. June 2021
180th Meeting of the Acoustical Society of America

Recently, a new approach for an all-silicon MEMS-based microspeaker has been presented for in-ear applications. The volume displacement is generated by multiple electrostatic actuated beams called “Nanoscopic Electrostatic Drives” (NED) that move in lateral direction between a top and a bottom silicon wafer. The top and the bottom wafers are provided with openings through which air can flow in and out.
Two fundamentally different actuator designs have been realized: An asymmetric electrostatic pull-actuator and an electrostatic push-pull actuator.
While the push-pull actuator can be actively displaced in both directions, the pull actuator can only be displaced actively in one direction and therefore requires an offset voltage to oscillate around a working point. These different driving schemes have a major impact on stability and harmonic distortions.
These two approaches implemented for MEMS loudspeakers were compared and the impact on acoustic performance was demonstrated by our Head of Technical Marketing, Lutz Ehrig in his presentation “From Single-Ended to Push-Pull Electrostatic MEMS Speakers for In-Ear Audio Applications” on 9th June at the conference Acoustics in Focus of the ASA.

News: Acoustics in Focus The 180th Meeting of the Acoustical Society of America 8-10 June 2021
08. Apr 2021
Interview with Mergermarket

On March 25, we participated at Tech Tour Future 21. Our successful participation was also noted by major financial intelligence platform Mergermarket. Following an interview with our Managing Director, Jan Blochwitz-Nimoth, Mergermarket published an article highlighting our growth, financing strategies as well as our objectives. 
Our CEO reported among other things on our preparations for Series A: “[Our] company is interested in raising the funds from venture capital firms with expertise in deep tech and with deep pockets […].”
When asked if we would also welcome US investors, Jan Blochwitz-Nimoth confirmed we would, “both to broaden [our] Europe-centric ownership and because a large proportion of [our] customers is in the region […].” We plan to be more active in discussions with investors in the third quarter of this year, therefore we are looking for interested parties. Our aim is to complete our Series A in the first half of 2022. 
Jan also said, “[we] plan to use the new capital to further develop [our] micro-speaker chip and prepare to commercialize it in 2024.”
Our goal is to become the number one provider of micro speaker technology for the ultra-mobile audio world. The article also explained that our microspeakers are easily scalable for mass markets, because they are CMOS compatible and thus widespread MEMS production capacities can be used.

News: Logo Mergermarket
25. March 2021
Arioso Systems at Tech Tour Future21

As an award winner of the Tech Tour Deep Tech Programme 2020 in the category Hardware & Systems, we were honored to participate at Tech Tour Future21. Our goal is to exchange and network with Europe’s leading tech entrepreneurs and investors. Furthermore, we would like to extend the circle of our investors. 
Tech Tour Future21 was taking place from 24th till 26th of March 2021.

News: Tech Tour Future21
14. Dec 2020
We are publicized in the January edition of the audioXpress magazine

In the article “Electrostatic Pure Silicon Microspeakers for Wireless Earbuds” of the audioXpress magazin January 2021 edition we explore how smart earbudes provide voice-controlled access to advanced Internet services. Read more about how our MEMS microspeaker, based on CMOS-compatible materials and manufacturing processes, is contributing to the next generation of wireless earbuds and how we apply pure silicon technology to create sound from the smallest of volumes. Read the full article here.

News: AudioXpress Cover January 2021

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