8. July 2022
Dresden Science Night

The Dresden Science Night is taking place on July 8 from 5 p.m. till 12 a.m. We will be there!
Our Head of New Business Development, Lutz Ehrig will be speaking about “Sound from Sand” at 10 p.m. in the Hörsaalzentrum of the Technical University Dresden in room E 05.
Lutz Ehrig will demonstrate how sound can be generated from 10mm² small microspeakers. Furtermore you will learn how the world’s first silicon speaker influences the hearing experience.

Dresden Science Night on July 8 from 5 p.m. till 12 a.m. at the Technical University Dresden
18. May 2022
The Ojo-Yoshida Report analyzes how MEMS micro speakers are contributing to the rise of hearables

The Ojo-Yoshida Report writes on the rise of the emerging market for hearables. In its recent market forecast, Juniper Research already predicted revenues of hearables to grow by 30% in total. True wireless systems and hearing aids require small speakers with longer battery life and expanded edge computing capacity. The market is growing thanks to the technological advances of MEMS components that meet these requirements.
The article from The Ojo-Yoshida Report shows that our company is an important contributor to this technological development. Our MEMS micro speakers improve the hearing experience, deliver the best sound quality, have extremely low power consumption and are scalable for the mass market.
Together with Bosch Sensortec, our aim is to play an important role in the expected market growth of 20 to 25 % in the coming years.

MEMS / Hearables / Wearables
13. May 2022
Arioso Systems at the open day at the Gründungszentrum in Cottbus

This Friday, on May 13 from 2 p.m. the Gründungszentrum, Startblock B2, in Cottbus is organising an open day. The open day is offering you to get to know Arioso Systems.
Come and visit us in our offices. You can experience our MEMS micro speakers and audio playback with our devices.

Gründungzentrum Open day May 13
28. Apr 2022
Arioso Systems to become part of Bosch Sensortec

We are excited to announce that we are joining forces with the world-leader for MEMS sensing solutions for consumer electronics. Bosch Sensortec plans to acquire Arioso Systems (subject to approvals) – find the press release here.
Together, we’ll be able to accelerate the further advancement of our MEMS micro speaker technology and develop cutting-edge products for the global high-volume consumer market. The whole Arioso team is looking forward to this next chapter of our success story.

Bosch Logo
09. Febr 2022
Registration of our trademark µSpeaker® on November 23, 2021

We are pleased to announce that our μSpeaker® trademark was registered by the United States Patent and Trademark Office on November 23, 2021.
Owning the μSpeaker® trademark will be a key element in promoting Arioso’s highly innovative pure silicon MEMS micro speaker technology.

Registration of our Trademark µSpeaker®
02. Jan 2022
Semiconductor Times profiles Arioso Systems as an emerging company

2022 starts with a feature on Arioso Systems in Pinestream’s Semiconductor Times magazine. In the article Cliff Hirsch highlights our technology targeted on high-fidelity sound experience, smaller size and lower power consumption in in-ear audio devices. Our goal for the first half of 2022 is to successfully complete Series A.
Read here how we want to conquer the ultra-mobile audio world with our MEMS microspeaker technology.

Semiconductor Times Logo
16. Dec 2021
Financial Times mentions our company regarding the semiconductor industry

“Saxony will become one of Europe’s main and most advanced industrial and technological semiconductor centres.” EU’s stated ambition is to invest in the most innovative chips. The German government also wants to financially support, strengthen and expand this key technology.
A chip ecosystem has been created that could attract smaller, cutting-edge entrants to the area, writes the Financial Times. We are mentioned in this context. We spoke to the FT about our technology and about recruiting suitable talents for the industry.

News: GEN4 MEMS micro speaker on 1 Eurocent Coin
01. Dec 2021
Fraunhofer Venture reports about our company

With our 10 mm² small and 100% silicon based MEMS microspeakers we aim to shape the future of the mobile internet. By increasing battery life and reducing battery drain, our silicon chips will help expand the functionality of wireless headphones to include instant translation, health monitoring and Internet of Voice services. In-ear headphones turn into better wearables.
From the Fraunhofer Venture press report in “Forschung Kompakt” you can learn all about our innovative and power-efficient sound transducer principle.

News: Fraunhofer Venture reports in Forschung Kompakt about our MEMS micro speakers for the future of the mobile internet MEMS Sound Chip in front of TWSEarbud
30. Nov – 03. Dec 2021
Hello Tomorrow Deep Tech Days 2021

We are happy to be selected as Deep Tech Pioneer. We are attending the Hello Tomorrow Deep Tech Days 2021 from November 30 till December 3 in Paris. This event series is Europe’s biggest deep tech event. The Global Summit and the Investor Day offers us a great opportunity to network and share ideas with investors.

News: We´ve been selected as one of the Deep Tech Pioneers of Hello Tomorrow!
01. Nov 2021
Heiko Weckbrodt from Oiger reports about us

Heiko Weckbrodt, journalist at Oiger, a news portal focusing on business and research in Saxony, met our CFO Jan Blochwitz-Nimoth at the investor-founder meeting “Hightech Venture Days”.
The article reports about our company and about our microelectromechanical micro speakers for smart hearables. It also provides insights into our strategic development and Series A financing goals.
Read the article in German.

News: Jan Blochwitz-Nimoth. Photo: Heiko Weckbrodt
26. Oct 2021
Our article is published in DeviceMed

In our article “Smarter Alltagshelfer statt Hörgerät – Vision oder Fiktion?” by DeviceMed, you can read about the challenges facing the hearing aid industry and how we would like to contribute with our technology to the technical progress of in-ear devices.
A hearing aid worn permanently in the ear should not be too large, must offer a long battery life and have good sound quality. Users also expect more and more smart functions and artificial intelligence.
With our pure silicon MEMS microspeaker, we offer a small, lightweight, energy-efficient, scalable and cost-effective component.
The article is available in German here.

MEMS Sound Generating Lamellas inside a Chip with Labeling in German
20. Oct – 03. Dec 2021
AES Online Fall 2021

Recently introduced MEMS micro speakers target in-ear audio applications such as true wireless earbuds, hearables and hearing aids. A key requirement in these ultra-mobile applications is a high energy efficiency of the components. In our presentation at AES Fall Online 2021, you will learn why MEMS microspeakers claim this competitive advantage.
The most advanced approaches to MEMS speakers are based on capacitive transducer technology. In this contribution, we discuss some fundamental energetic relations that such electroacoustic transducers are subject to, and draw some implications for the requirements of a transducer that can operate at high efficiency.

News: AES Fall Online 2021 Streamcast October 2021
07. – 08. Sep 2021
MEMS World Summit EU

The MEMS World Summit EU in Munich brings together political, business, financial, research and industry leaders in the field of micro electrical mechanical systems. This world’s leading MEMS manufacturing gathering took place from 7th to 8th September. Our Head of MEMS Development, Holger Conrad explained why MEMS microspeakers made from 100% silicon are the best solution for audio reproduction in wireless in-ear headphones. In his presentation on 8th September at 4:25 p.m. CET, he showed balanced speaker designs and technology with improved linearity. 

News: MEMS World Summit Europe 2021 in Munich: our Head of MEMS Production, Holger Conrad is presenting about highly efficient balanced all-silicon electrostatic MEMS micro speakers
15. – 18. Aug 2021
DAGA 2021

The demand for wireless earbuds is increasingly shifting towards aspects beyond sound quality, such as comfort, increased battery life and integration with other electronic components. These factors impose tighter requirements in the power budget for the audio transducer.
At DAGA2021 our Head of Technical Marketing, Lutz Ehrig, answered the question of how MEMS speakers can become more powerful than moving-coil speakers and gain competitive advantage. During the online session “MEMS loudspeakers – where do we stand today?” we discussed some basic energetic relationships that such electroacoustic transducers are subject to and draw some conclusions from these relationships on the requirements for a transducer that can operate with high efficiency.

News: DAGA 2021 Wien
15. July 2021
Fraunhofer reports about us

Our technology does everything differently from previous techniques. With this approach, we want to offer a new gateway into the digital world.
Our innovation: “We have virtually thrown overboard the central element of a loudspeaker, the membrane. Insted, we integrate many thin bending bars, similar to the strings of a harp, into a MEMS silicon chip. This gives us a large acoustic inner surface, but at the same time we can keep the outer surface minimal.”
Beside the innovation of our technology,  you can read in the latest article of Fraunhofer magazine how our microspeakers emerged from a failed start and what are still planing. Click here to read the article in German.

News: Fraunhofer article about Arioso Systems
12. July 2021
We are featured in Handelsblatt

Europe is increasingly disappearing from the semiconductor world map.
In 2020, only 8.5% of the industry’s turnover was generated in Europe. Between 2015 and 2020, the industry grew globally by an average of 5.6% each year, in Europe by only 1.8%.
Our CEO, Jan Blochwitz Nimoth and two other Dresden-based start-ups are quoted from a conversation with Handelsblatt, explaining their chip innovations and the potential for Europe to stop this decline in global market share. Our goal is to become a globally leading chip design house, thus also contributing to the relevance of Europe.
You can access the article here.

MEMS Sound Chip on 1 Euro Cent
08. – 10. June 2021
180th Meeting of the Acoustical Society of America

Recently, a new approach for an all-silicon MEMS-based microspeaker has been presented for in-ear applications. The volume displacement is generated by multiple electrostatic actuated beams called “Nanoscopic Electrostatic Drives” (NED) that move in lateral direction between a top and a bottom silicon wafer. The top and the bottom wafers are provided with openings through which air can flow in and out.
Two fundamentally different actuator designs have been realized: An asymmetric electrostatic pull-actuator and an electrostatic push-pull actuator.
While the push-pull actuator can be actively displaced in both directions, the pull actuator can only be displaced actively in one direction and therefore requires an offset voltage to oscillate around a working point. These different driving schemes have a major impact on stability and harmonic distortions.
These two approaches implemented for MEMS loudspeakers were compared and the impact on acoustic performance was demonstrated by our Head of Technical Marketing, Lutz Ehrig in his presentation “From Single-Ended to Push-Pull Electrostatic MEMS Speakers for In-Ear Audio Applications” on 9th June at the conference Acoustics in Focus of the ASA.

News: Acoustics in Focus The 180th Meeting of the Acoustical Society of America 8-10 June 2021
08. Apr 2021
Interview with Mergermarket

On March 25, we participated at Tech Tour Future 21. Our successful participation was also noted by major financial intelligence platform Mergermarket. Following an interview with our Managing Director, Jan Blochwitz-Nimoth, Mergermarket published an article highlighting our growth, financing strategies as well as our objectives. 
Our CEO reported among other things on our preparations for Series A: “[Our] company is interested in raising the funds from venture capital firms with expertise in deep tech and with deep pockets […].”
When asked if we would also welcome US investors, Jan Blochwitz-Nimoth confirmed we would, “both to broaden [our] Europe-centric ownership and because a large proportion of [our] customers is in the region […].” We plan to be more active in discussions with investors in the third quarter of this year, therefore we are looking for interested parties. Our aim is to complete our Series A in the first half of 2022. 
Jan also said, “[we] plan to use the new capital to further develop [our] micro-speaker chip and prepare to commercialize it in 2024.”
Our goal is to become the number one provider of micro speaker technology for the ultra-mobile audio world. The article also explained that our microspeakers are easily scalable for mass markets, because they are CMOS compatible and thus widespread MEMS production capacities can be used.

News: Logo Mergermarket
25. March 2021
Arioso Systems at Tech Tour Future21

As an award winner of the Tech Tour Deep Tech Programme 2020 in the category Hardware & Systems, we were honored to participate at Tech Tour Future21. Our goal is to exchange and network with Europe’s leading tech entrepreneurs and investors. Furthermore, we would like to extend the circle of our investors. 
Tech Tour Future21 was taking place from 24th till 26th of March 2021.

News: TechTour Future21
14. Dec 2020
We are publicized in the January edition of the audioXpress magazine

In the article “Electrostatic Pure Silicon Microspeakers for Wireless Earbuds” of the audioXpress magazin January 2021 edition we explore how smart earbudes provide voice-controlled access to advanced Internet services. Read more about how our MEMS microspeaker, based on CMOS-compatible materials and manufacturing processes, is contributing to the next generation of wireless earbuds and how we apply pure silicon technology to create sound from the smallest of volumes. Read the full article here.

News: AudioXpress Cover January 2021


ELV journal Link to article
AROGED Link to article
TECHSPOT Link to article
NEW ATLAS Link to article
channel-e Link to article
Oiger Logo Link to article
DeviceMed Link to article
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